Wen Zhi Wang
Director of Finance/CFO chez NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD.
Profil
Wen Zhi Wang is an Independent Director at Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
and the Chief Financial Officer & Deputy General Manager at Ningbo Fangzheng Automobile Mould Co., Ltd.
He previously held the position of Chief Financial Officer & Deputy General Manager at Shenzhen Silver Basis Technology Co., Ltd.
and Chief Financial Officer at Shenzhen Yinghe Technology Co., Ltd.
Postes actifs de Wen Zhi Wang
Sociétés | Poste | Début |
---|---|---|
NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD. | Director of Finance/CFO | 11/12/2023 |
Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China. | Director/Board Member | 25/01/2022 |
Anciens postes connus de Wen Zhi Wang
Sociétés | Poste | Fin |
---|---|---|
SHENZHEN YINGHE TECHNOLOGY CO., LTD | Director of Finance/CFO | - |
SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD. | Director of Finance/CFO | - |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
Sociétés cotées | 3 |
---|---|
NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD. | Producer Manufacturing |
SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD. | Consumer Services |
SHENZHEN YINGHE TECHNOLOGY CO., LTD | Producer Manufacturing |
Entreprise privées | 1 |
---|---|
Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China. | Electronic Technology |