Hong Feng Liu
Public Communications Contact chez BOE TECHNOLOGY GROUP COMPANY LIMITED
Fortune : 853 579 $ au 31/03/2024
Profil
Hong Feng Liu is currently the Director at Beijing Nissin Electronics Precision Component Co. Ltd.
and the Board Secretary & Vice President at BOE Technology Group Co., Ltd.
Prior to his current positions, he graduated from Beihang University.
Détentions connues dans des sociétés publiques
| Société | Date | Nombre d'actions | Valorisation | Date de valorisation |
|---|---|---|---|---|
| 30/06/2023 | 1 024 500 ( 0,00% ) | 575 513 $ | 31/03/2024 | |
| 30/06/2023 | 495 000 ( 0,16% ) | 278 066 $ | 31/03/2024 |
Postes actifs de Hong Feng Liu
| Sociétés | Poste | Début |
|---|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Public Communications Contact | - |
Beijing Nissin Electronics Precision Component Co. Ltd.
 Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Director/Board Member | - |
Formation de Hong Feng Liu
| Beihang University | Graduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| BOE TECHNOLOGY GROUP COMPANY LIMITED | Electronic Technology |
| Entreprise privées | 1 |
|---|---|
Beijing Nissin Electronics Precision Component Co. Ltd.
Beijing Nissin Electronics Precision Component Co. Ltd. Miscellaneous ManufacturingProducer Manufacturing Beijing Nissin Electronics Precision Component Co. Ltd. is a private company that manufactures metal stampings. The company is based in Beijing, China. | Producer Manufacturing |
