![Chi Wen Tsai](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Chi Wen Tsai
Directeur Général chez
SILICONWARE PRECISION INDUSTRIES CO, LTD
Fortune : 298 M $ au 31/05/2026
Profil
Chi Wen Tsai is the founder of Siliconware Precision Industries Co., Ltd., which was founded in 1984.
He currently holds the position of Chairman, President & Chief Executive Officer at Siliconware Precision Industries Co., Ltd. Additionally, Mr. Tsai is currently the Chairman of Siliconware Electronics (Fujian) Co., Ltd., Director at Siliconware USA, Inc., Director at SPIL (Cayman) Holding Ltd., Director at Siliconware Technology (Suzhou) Ltd., and Director at ASE Technology Holding Co., Ltd. He obtained his undergraduate degree from National Taipei University of Technology in 1969.
Détentions connues dans des sociétés publiques
| Société | Date | Nombre d'actions | Valorisation | Date de valorisation |
|---|---|---|---|---|
| 18/03/2026 | 15 264 000 ( 0,34 % ) | 298 M $ | 31/05/2026 |
Postes actifs de Chi Wen Tsai
| Sociétés | Poste | Début |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO, LTD | Directeur Général | 16/08/1984 |
| ASE TECHNOLOGY HOLDING CO., LTD. | Directeur/Membre du Conseil | 30/04/2018 |
Siliconware USA, Inc.
 Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | Directeur/Membre du Conseil | 13/10/2010 |
SPIL (Cayman) Holding Ltd.
 SPIL (Cayman) Holding Ltd. Financial ConglomeratesFinance Operates as an investment holding company | Directeur/Membre du Conseil | - |
Siliconware Technology (Suzhou) Ltd.
 Siliconware Technology (Suzhou) Ltd. Computer PeripheralsElectronic Technology Manufactures module assembly and testing & flash memory card | Directeur/Membre du Conseil | 13/10/2010 |
Siliconware Electronics (Fujian) Co., Ltd.
 Siliconware Electronics (Fujian) Co., Ltd. SemiconductorsElectronic Technology Manufactures semiconductor and related device | Président | - |
Formation de Chi Wen Tsai
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
35
Relations au 1er degré
7
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 7 |
|---|---|
Siliconware Precision Industries Co., Ltd.
 Siliconware Precision Industries Co., Ltd. SemiconductorsElectronic Technology Operates as a semiconductors assembling and testing company | Electronic Technology |
Siliconware USA, Inc.
Siliconware USA, Inc. Marine ShippingTransportation The company is based in San Jose, CA. Part of ASE Technology Holding Co., Ltd., Siliconware USA, Inc. provides semiconductor assembly, packaging, testing, and wafer bumping services. The company offers backend IC manufacturing solutions, including advanced packaging technologies such as laminate substrate, leadframe, wafer-level chip scale packaging, stacked die, multi-package ball grid array, and 2.5D/3D integration with through-silicon vias. Its portfolio includes system-in-package, fan-out wafer-level packaging, flip chip, fine pitch wire bonding, molding, and antenna-in-package. Siliconware USA delivers in-house design capabilities, package characterization, reliability testing, and failure analysis. Wafer bumping services support both 200mm and 300mm wafers with various bumping technologies for semiconductor products like GPUs, PMICs, APs, high-performance computing chips, wireless devices, AI servers, IoT, and RFICs. The company serves markets such as computing, mobile devices, telecommunications, consumer electronics, automotive, AI, VR/AR, and IoT. Its operations include certified clean rooms and automated environmental controls. | Transportation |
National Taipei University of Technology
 National Taipei University of Technology Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
SPIL (Cayman) Holding Ltd.
SPIL (Cayman) Holding Ltd. Financial ConglomeratesFinance Operates as an investment holding company | Finance |
Siliconware Technology (Suzhou) Ltd.
Siliconware Technology (Suzhou) Ltd. Computer PeripheralsElectronic Technology Manufactures module assembly and testing & flash memory card | Electronic Technology |
ASE Technology Holding Co., Ltd.
 ASE Technology Holding Co., Ltd. SemiconductorsElectronic Technology Operates as a holding company providing semiconductor manufacturing services | Electronic Technology |
Siliconware Electronics (Fujian) Co., Ltd.
Siliconware Electronics (Fujian) Co., Ltd. SemiconductorsElectronic Technology Manufactures semiconductor and related device | Electronic Technology |
