Profil
Hisao Nishimura is currently the Chairman at Bandick Corp.
He previously worked as the Representative Director at Towa Corp.
from 2012 to 2013 and as a Manager at The Bank of Kyoto, Ltd.
Postes actifs de Hisao Nishimura
| Sociétés | Poste | Début |
|---|---|---|
Bandick Corp.
 Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life. | Président | 01/04/2012 |
Anciens postes connus de Hisao Nishimura
| Sociétés | Poste | Fin |
|---|---|---|
The Bank of Kyoto, Ltd.
 The Bank of Kyoto, Ltd. Major BanksFinance The Bank of Kyoto, Ltd. engages in the provision of financial services. It operates through the Banking Business and Others segments. The Banking Business segment includes deposits and loans services, trading securities, securities investment, and domestic and foreign exchange services. The Others segment includes credit guarantee, lease, and credit card businesses. The company was founded on October 1, 1941 and is headquartered in Kyoto, Japan. | Corporate Officer/Principal | - |
| TOWA CORPORATION | President | 29/05/2012 |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| TOWA CORPORATION | Producer Manufacturing |
| Entreprise privées | 2 |
|---|---|
The Bank of Kyoto, Ltd.
The Bank of Kyoto, Ltd. Major BanksFinance The Bank of Kyoto, Ltd. engages in the provision of financial services. It operates through the Banking Business and Others segments. The Banking Business segment includes deposits and loans services, trading securities, securities investment, and domestic and foreign exchange services. The Others segment includes credit guarantee, lease, and credit card businesses. The company was founded on October 1, 1941 and is headquartered in Kyoto, Japan. | Finance |
Bandick Corp.
Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life. | Producer Manufacturing |
