![Jung Sheng Li](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Jung Sheng Li
President chez
Kun Hong Business Co. Ltd.
Profil
Jung Sheng Li is currently the President of Kun Hong Business Co. Ltd. Prior to this, he worked as a Director at Chipbond Technology Corp.
from 1997 to 2012.
He obtained an undergraduate degree from Fu Jen Catholic University.
Postes actifs de Jung Sheng Li
| Sociétés | Poste | Début |
|---|---|---|
Kun Hong Business Co. Ltd.
 Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | President | - |
Anciens postes connus de Jung Sheng Li
| Sociétés | Poste | Fin |
|---|---|---|
| CHIPBOND TECHNOLOGY CORPORATION | Directeur/Membre du Conseil | - |
Formation de Jung Sheng Li
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
19
Relations au 1er degré
3
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
Chipbond Technology Corp.
 Chipbond Technology Corp. SemiconductorsElectronic Technology Manufactures and distributes wafer bumps, chips, and other electronic components | Electronic Technology |
Kun Hong Business Co. Ltd.
Kun Hong Business Co. Ltd. Auto Parts: OEMProducer Manufacturing Manufactures and exports auto parts and accessories | Producer Manufacturing |
Fu Jen Catholic University
 Fu Jen Catholic University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
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