Ming Hsien Chen
Director/Board Member chez EIRGENIX INC.
Profil
Ming Hsien Chen is currently an Independent Director at Kingpak Technology, Inc. and EirGenix, Inc. He is also a Professor at National Taiwan University.
Previously, he served as a Director-Supervisory Board at Kingpak Technology, Inc. Chen holds a doctorate degree from Michigan State University and undergraduate and graduate degrees from National Taiwan University.
Postes actifs de Ming Hsien Chen
| Sociétés | Poste | Début |
|---|---|---|
| EIRGENIX INC. | Director/Board Member | 13/09/2016 |
| KINGPAK TECHNOLOGY INC. | Director/Board Member | 31/05/2016 |
| National Taiwan University | Corporate Officer/Principal | 24/10/2011 |
Anciens postes connus de Ming Hsien Chen
| Sociétés | Poste | Fin |
|---|---|---|
Kingpak Technology, Inc. /Old/
 Kingpak Technology, Inc. /Old/ Electronic Production EquipmentElectronic Technology Kingpak Technology, Inc. (GR: 8172) is an independent Taiwan-based firm which provides integrated circuit package assembly services. Their products include ball grid array, secure digital card, multimedia card, compact camera module, and plastic leaded chip carrier. The firm was founded in 1997 and is headquartered in Chu-Pei, Taiwan. | Director/Board Member | - |
Formation de Ming Hsien Chen
| Michigan State University | Doctorate Degree |
| National Taiwan University | Graduate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| EIRGENIX INC. | Health Technology |
| Entreprise privées | 2 |
|---|---|
Kingpak Technology, Inc. /Old/
Kingpak Technology, Inc. /Old/ Electronic Production EquipmentElectronic Technology Kingpak Technology, Inc. (GR: 8172) is an independent Taiwan-based firm which provides integrated circuit package assembly services. Their products include ball grid array, secure digital card, multimedia card, compact camera module, and plastic leaded chip carrier. The firm was founded in 1997 and is headquartered in Chu-Pei, Taiwan. | Electronic Technology |
Kingpak Technology, Inc.
 Kingpak Technology, Inc. SemiconductorsElectronic Technology Kingpak Technology, Inc. engages in the testing and sale of complementary metal-oxide semiconductor (CMOS) image sensor, CMOS image sensors (CIS) and integrated circuit packaging. It mainly focuses on consumer products, wearable products, safety monitoring & automobile related CIS packaging as well as video testing services. The company's products include CMOS image sensor, micro-electro-mechanical systems (MEMS), ball grid array (BGA), and system in package (SiP). Kingpak Technology was founded on May 8, 1991 and is headquartered in Taipei, Taiwan. | Electronic Technology |
