![G. William Knapp](data:image/svg+xml,<svg xmlns="http://www.w3.org/2000/svg" width="16" height="16" fill="%231b1b1b" class="bi bi-person-fill" viewBox="0 0 16 16"><path d="M3 14s-1 0-1-1 1-4 6-4 6 3 6 4-1 1-1 1zm5-6a3 3 0 1 0 0-6 3 3 0 0 0 0 6"/></svg>)
Profil
G.
William Knapp is Vice President of Engineering for Ziptronix, Inc. He was Vice President of Development for Conexant/Mindspeed.
He was Vice President of Advanced Network Processing Products for Vitesse Semiconductor Corporation.
He received an undergraduate degree from the University of Cincinnati and a graduate degree from North Carolina State University.
Anciens postes connus de G. William Knapp
| Sociétés | Poste | Fin |
|---|---|---|
Invensas Bonding Technologies, Inc.
 Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Designs and develops semiconductor integration technology | Corporate Officer/Principal | - |
Formation de G. William Knapp
Expériences
Fonctions occupées
Actives
Inactives
Sociétés cotées
Entreprise privées
Relations
90
Relations au 1er degré
3
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Entreprise privées | 3 |
|---|---|
Invensas Bonding Technologies, Inc.
Invensas Bonding Technologies, Inc. SemiconductorsElectronic Technology Designs and develops semiconductor integration technology | Electronic Technology |
North Carolina State University
 North Carolina State University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
University of Cincinnati (Ohio)
 University of Cincinnati (Ohio) Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
