Chih-Ming Lai
Chief Executive Officer chez Jiangyin Changdian Advanced Packaging Co., Ltd.
Profil
Chih-Ming Lai is currently the Chief Executive Officer of Jiangyin Changdian Advanced Packaging Co., Ltd.
He previously served as the Chief Executive Officer & Executive Director of STATS ChipPAC Pte Ltd.
from 2017 to 2018 and as a Non-Executive Non-Independent Director from 2015 to 2017.
He also held the position of Executive Vice President at JCET Group Co., Ltd.
Postes actifs de Chih-Ming Lai
| Sociétés | Poste | Début |
|---|---|---|
Jiangyin Changdian Advanced Packaging Co., Ltd.
 Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Chief Executive Officer | - |
Anciens postes connus de Chih-Ming Lai
| Sociétés | Poste | Fin |
|---|---|---|
| STATS CHIPPAC LTD. | Chief Executive Officer | 27/09/2018 |
| STATS CHIPPAC LTD. | Director/Board Member | 22/02/2017 |
| JCET GROUP CO., LTD. | Corporate Officer/Principal | - |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
| Sociétés cotées | 1 |
|---|---|
| JCET GROUP CO., LTD. | Electronic Technology |
| Entreprise privées | 2 |
|---|---|
STATS ChipPAC Pte Ltd.
 STATS ChipPAC Pte Ltd. Electronic Equipment/InstrumentsElectronic Technology STATS ChipPAC Pte Ltd. engages in the provision of semiconductor test and packaging services. Its services includes design, characterization, and wafer bumping.The company was founded by June Lihan Chia in 1994 and is headquartered in Singapore. | Electronic Technology |
Jiangyin Changdian Advanced Packaging Co., Ltd.
Jiangyin Changdian Advanced Packaging Co., Ltd. SemiconductorsElectronic Technology Part of JCET Group Co., Ltd., Jiangyin Changdian Advanced Packaging Co., Ltd. is a private company that manufactures and develops semiconductor chip and related products. The company is based in Jiangyin, China. The CEO of the Chinese company is Chih-Ming Lai. | Electronic Technology |
