Profil
Hui-Feng Wu is currently the Chairman at Ingrasys Technology USA, Inc. He was previously the Chairman at Ennoconn Corp., Director & Executive Vice President at Foxconn Industrial Internet Co., Ltd., and Member-Supervisory Board at Kontron AG.
He graduated from The Ohio State University in 1976.
Postes actifs de Hui-Feng Wu
| Sociétés | Poste | Début |
|---|---|---|
Ingrasys Technology USA, Inc.
Ingrasys Technology USA, Inc. Electronic Equipment/InstrumentsElectronic Technology Manufactures electricity measuring instruments | Président | - |
Anciens postes connus de Hui-Feng Wu
| Sociétés | Poste | Fin |
|---|---|---|
| FOXCONN INDUSTRIAL INTERNET CO., LTD. | Directeur/Membre du Conseil | 10/07/2020 |
| ENNOCONN CORPORATION | Président | - |
| KONTRON AG | Directeur/Membre du Conseil | - |
Formation de Hui-Feng Wu
Expériences
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Inactives
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Entreprise privées
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Entreprises liées au 1er degré
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Sociétés liées
| Entreprise privées | 5 |
|---|---|
The Ohio State University
The Ohio State University Other Consumer ServicesConsumer Services Functions as a College/University | Consumer Services |
Kontron AG
Kontron AG Computer Processing HardwareElectronic Technology Provides information technology services | Electronic Technology |
Ennoconn Corp.
Ennoconn Corp. Electronic ComponentsElectronic Technology Designs and manufactures industrial motherboards and provide total hardware system solutions | Electronic Technology |
Ingrasys Technology USA, Inc.
Ingrasys Technology USA, Inc. Electronic Equipment/InstrumentsElectronic Technology Manufactures electricity measuring instruments | Electronic Technology |
Foxconn Industrial Internet Co., Ltd.
Foxconn Industrial Internet Co., Ltd. Telecommunications EquipmentElectronic Technology Designs, manufactures and supplies communication network equipment, cloud service equipment, precision tools and industrial robots | Electronic Technology |
















