Société Amkor Technology, Inc.

Manufactures semiconductors and provides assembly and test services

Part of Amkor Technology, Inc., Amkor Advanced Technology Taiwan, Inc. is a provider of advanced semiconductor packaging and test solutions serving markets such as automotive, communications, consumer electronics, industrial, AI, 5G, and high-performance computing. The company is located in Taiwan. The Taiwanese company offers a range of packaging technologies including microleadframe® (MLF®) near chip-scale packages, toll power discrete packages for automotive and high-power applications, wafer-level chip scale packages (WLCSP), flip chip, system-in-package (SiP), fan-out wafer-level packaging (FOWLP), and advanced heterogeneous integration solutions. Innovations include S-Connect™, a silicon bridge die interposer for high-bandwidth chiplet integration; S-Swift™, a fan-out packaging technology for high I/O density; and advanced antenna in package (AiP) and antenna on package (AoP) solutions for 5G mmWave and sub-6 GHz RF modules. The company also provides IC design services focused on cost, manufacturability, and performance optimization, as well as package characterization capabilities covering electrical, mechanical, RF, and thermal domains. Semiconductor test services include wafer probe, package test, burn-in, and system-level testing with turnkey solutions for complex applications. Packaging solutions emphasize miniaturization, thermal and electrical performance, and design flexibility, featuring technologies such as exposedpad for heat dissipation, wettable flanks for automotive reliability, and edge protection™ for mechanical robustness.

Functions as an investment holding company