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Provenance du réseau au premier degré de Hisao Nishimura
Entité | Type d'entité | Industrie | |
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Bandick Corp.
![]() Bandick Corp. Miscellaneous ManufacturingProducer Manufacturing Part of Towa Corp., Bandick Corp. is a Japanese semiconductor packaging solution company focused on meeting customer needs. The company specializes in a transfa system that uses fluid resin to protect semiconductor chips and sell molding devices using compression methods. The company's goal is to create a new future in the field of semiconductor packaging with a quarter lead and the world's most advanced technology. The company also offers a cbn end mill product with high accuracy, wear resistance, and long life.
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| Subsidiary | Miscellaneous Manufacturing | 1 |
Graphique Sociétés connectées au second degré
Relation dans plusieurs entreprises
Sociétés connectées à Hisao Nishimura via son réseau personnel
Société | Secteur | Personnes liées | Poste principal |
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Statistiques
Internationale
Sectorielle
Opérationnelle
Director/Board Member | 1 |
President | 1 |
Relations les plus connectées
Insiders | |
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Tamotsu Akiyama | 1 |
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