Hsiu-Ying Chiu
Corporate Officer/Principal chez SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD.
Profil
Hsiu-Ying Chiu is currently the Chief Strategy Officer at Shin Foong Specialty & Applied Materials Co., Ltd.
She previously worked as the Director & Head-Finance Department at YFY, Inc., Director at Chung Hwa Pulp Corp., Director at BoardTek Electronics Corp., and Director at TaiGen Biopharmaceuticals Holdings Ltd.
from 2013 to 2018.
Dr. Chiu holds doctorate degrees from Carnegie Mellon University, the University of Pittsburgh, and National Taiwan University.
Postes actifs de Hsiu-Ying Chiu
Sociétés | Poste | Début |
---|---|---|
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Corporate Officer/Principal | 22/09/2022 |
Anciens postes connus de Hsiu-Ying Chiu
Sociétés | Poste | Fin |
---|---|---|
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Director/Board Member | 17/12/2018 |
CHUNG HWA PULP CORPORATION | Director/Board Member | - |
BOARDTEK ELECTRONICS CORP | Director/Board Member | - |
YFY INC. | Director of Finance/CFO | - |
Formation de Hsiu-Ying Chiu
Carnegie Mellon University | Doctorate Degree |
University of Pittsburgh | Doctorate Degree |
National Taiwan University | Doctorate Degree |
Expériences
Fonctions occupées
Relations
Relations au 1er degré
Entreprises liées au 1er degré
Homme
Femme
Administrateurs
Exécutifs
Sociétés liées
Sociétés cotées | 4 |
---|---|
YFY INC. | Process Industries |
CHUNG HWA PULP CORPORATION | Process Industries |
TAIGEN BIOPHARMACEUTICALS HOLDINGS LIMITED | Health Technology |
SHIN FOONG SPECIALTY AND APPLIED MATERIALS CO., LTD. | Process Industries |
Entreprise privées | 1 |
---|---|
BoardTek Electronics Corp.
BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |